全文获取类型
收费全文 | 12846篇 |
免费 | 392篇 |
国内免费 | 1872篇 |
学科分类
工业技术 | 15110篇 |
出版年
2023年 | 5篇 |
2022年 | 3篇 |
2021年 | 20篇 |
2020年 | 33篇 |
2019年 | 2篇 |
2017年 | 30篇 |
2016年 | 19篇 |
2015年 | 32篇 |
2014年 | 159篇 |
2013年 | 132篇 |
2012年 | 277篇 |
2011年 | 1838篇 |
2010年 | 959篇 |
2009年 | 527篇 |
2008年 | 482篇 |
2007年 | 389篇 |
2006年 | 498篇 |
2005年 | 488篇 |
2004年 | 1842篇 |
2003年 | 1006篇 |
2002年 | 851篇 |
2001年 | 653篇 |
2000年 | 355篇 |
1999年 | 692篇 |
1998年 | 460篇 |
1997年 | 449篇 |
1996年 | 214篇 |
1995年 | 173篇 |
1994年 | 132篇 |
1993年 | 646篇 |
1992年 | 550篇 |
1991年 | 329篇 |
1990年 | 311篇 |
1989年 | 226篇 |
1988年 | 159篇 |
1987年 | 19篇 |
1986年 | 20篇 |
1985年 | 26篇 |
1984年 | 20篇 |
1983年 | 11篇 |
1982年 | 15篇 |
1981年 | 7篇 |
1980年 | 15篇 |
1979年 | 14篇 |
1977年 | 3篇 |
1973年 | 2篇 |
1966年 | 4篇 |
1965年 | 3篇 |
1959年 | 2篇 |
1958年 | 3篇 |
排序方式: 共有10000条查询结果,搜索用时 31 毫秒
61.
实施ERP如何才算成功的条件和标准。一直是最关心的话题。国内的IT界流行这样一句话“中国的信息化项目没有失败的。因为谁都不敢轻言和直言失败。”
其实信息化项目想成功因素很多,甚至不是一本书能写完的。这么大的话题为什么还要再写呢?在个人能力有限的情况下如何帮助项目一步一步走向成功是非常关键的。 相似文献
62.
在云计算、大数据愈演愈烈之时,未来企业lT将怎样发展?诸多解决方案供应商均发布了对未来IT发展趋势的预测,除了云计算、虚拟化以及大数据等热门词汇毫无悬念地位居其中之外,数据容灾首次得到专门“对待”,预测认为现有备份方式将被改变,简化管理将成为未来灾备技术的重要发展趋势。lDC大中华区总裁郭听认为,未来的所有产业都将具备lT基因, 相似文献
63.
This work investigates internal plasma process parameters using a hairpin resonance probe and optical emission spectroscopy. The dependence of electron density and atomic fluorine on the percentage of oxygen in an SF6 /O2 discharge was measured using these methods. An RIE Oxford Instruments 80 plus chamber was used for the experiments. Two different process powers (100 W and 300 W) at a constant pressure (100 mTorr) were used, and it was found that the optical emission intensity of the 703.7 nm and 685.6 nm lines of atomic fluorine increased rapidly as oxygen was added to the SF6 discharge, reached their maximum at an O2 fraction of 20% and then decreased with further addition of oxygen. The plasma electron density was also strongly influenced by the addition of O2 . 相似文献
64.
65.
Guo Pei Zhao Xiaohui Xiong Jie Xia Yudong Jing Tongguo Chen Jue Zhang Ning Zhang Fei Tao Bowan Li Yanrong State Key Laboratory of Electronic Thin Films Integrated Devices University of Electronic Science Technology of China Chengdu China 《稀有金属材料与工程》2011,(Z3)
In this study,a simple template consisted of Y2O3 and La2Zr2O7 (LZO) layers was fabricated on rolling assisted biaxially textured Ni-5at%W substrates for YBa2Cu3O7-δ (YBCO) coated conductors.A thin sputtered Y2O3 layer (~20 nm) was introduced as a seed layer in order to induce epitaxial growth of metal organic deposited LZO layer.The effects of Y2O3 layer,annealing temperature and dwelling time on the phase and texture of the LZO films were systematically investigated.X-ray diffraction exhibited that the LZ... 相似文献
66.
Zhou Zheng Wang Lu He Dingyong Liu Yanbo Zhang Guanzhen Beijing University of Technology Beijing China Beijing Institute of Technology Beijing 《稀有金属材料与工程》2011,(Z3)
Amorphous metallic coatings with a composition of Fe48Cr15Mo14C15B6Y2 were prepared by means of atmospheric plasma spraying (APS) process under different conditions. The microstructure and frictional behavior were characterized simultaneously in this article. The results show that the as-deposited coatings consist of amorphous matrix and some precipitated nanocrystals, while the amorphous fraction and particle deformation as well as crystallization mechanism are significantly sensitive to the spraying param... 相似文献
67.
Vacuum differential pressure casting has advantages of smelting in vacuum, filling steadily, solidifying under high pressure. Process parameters of filling and solidification are important to the final castings’ forming properties, the parameters include vacuum degree, gas flow, filling velocity, filling pressure, rising pressure velocity, holding pressure and keeping pressure time. By casting copper alloy impeller, we calculated and deduced the gas flow, filling velocity, filling pressure, rising pressure ... 相似文献
68.
Reliability of flip-chip bonded RFID die using anisotropic conductive paste hybrid material 总被引:1,自引:0,他引:1
A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process. 相似文献
69.
以热挤压材为坯料,经多道次热轧制备AZ40Mg合金板材。研究热轧变形对合金组织、力学性能与断裂行为的影响。结果表明:随着热轧道次的增加,通过动态再结晶,材料的组织均匀性得到逐步改善,晶粒尺寸持续细化。相应地,热轧板材的力学性能与挤压态坯料相比得到显著改善。经过5道次以上热轧制备的AZ40Mg合金板材,其平均晶粒尺寸细化到10μm以下,轧向及横向的室温拉伸屈服强度与伸长率均可分别达到175MPa和20%以上。 相似文献
70.
在室温下,挤压态镁合金丝材最大累计面积减少61%,并对所得材料进行退火处理以细化晶粒。在室温下以恒定的应变速率对拉拔态和退火态试样进行拉伸试验,分析每个试样的拉拔面积减少量和平均晶粒尺寸与整个应力—应变曲线的关系。结果表明:冷变形试样具有恒定的弹性模量,但应力明显依赖变形程度。相应的θ—σ曲线(θ代表加工硬化速率,dσ/dε)表现为加工硬化扩展阶段Ⅱ和抑制阶段Ⅳ。再结晶试样随着晶粒的细化屈服应力增高且表现出典型的多晶材料加工硬化阶段:Ⅱ,Ⅲ,Ⅳ和Ⅴ。此外,随着晶粒的细化,由于晶界滑移的作用,第Ⅳ阶段出现下降。在冷拉和再结晶材料中,不同的硬化行为显示出不同的硬化机理。 相似文献